Open Cavity Ceramic Package

Ceramic lids for our air cavity qfn packages.

Open cavity ceramic package. Open cavity packages are available in a variety of package types including qfn soic and qfp. The flange or heatsink material has evolved over the years and the most commonly used material today is cpc cu mo70cu cu a laminate of copper and coppermolybdenum. Sempac s qfn quad flat no lead air cavity package are designed with specially formulated molding compounds gold plated copper alloy leadframes and are compact in size but offer high performance. Our standard flat lids are made from 91 alumina ceramic.

We can assemble prototypes in open cavity packages in as little as. The traditional package for rf power transistors is the air cavity package with a ceramic lid. The flange or heatsink material has evolved over the years and the most commonly used material today is cpc cu mo70cu cu a laminate of copper and coppermolybdenum. Minimum pin count is 28 while the maximum pin count is limited to the manufacturer s capabilities.

Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016. Majelac technologies offers open cavity packages for quick assembly of your prototype ic s. The traditional package for rf power transistors is the air cavity package with a ceramic lid. Quik pak offers matching lids for our new line of open cavity packages called open molded plastic packages.

Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. If you don t have a specific ic package identified we can provide technical assistance to select the best ic package for your application. Quik pak can provide virtually any ic package you need for your prototype devices such as open molded plastic packages ompp open cavity plastic packages ocpp ceramic ic packages laminate substrates and even custom ic package configurations. Cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up.

Open cavity packages have evolved to be the preferred solution for prototype and low volume assembly of integrated circuits. We also have flat plastic lids made from the same rohs and reach compliant plastic that we use to make our qfn packages. Our open pak technology has become a popular choice with packaging and design engineers for its. Ceramic ceramic mems ceramic plastic ceramic plastic open cavity interposer plastic plastic open cavity plastic soic clcc jlcc dil cqfp pga tqfp qfn plastic open cavity packages optical lid resin chip on board thermal solutions hermetic package interposer wb assembly.

Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition.